기사 (17건)
[Semiconductor]
Samsung orders dozens of TC bonders from Semes
Noh Tae Min 기자 | 2024-01-08 11:30
[Display Panel]
Samsung Display rejects Kateeva’s RGB inkjet equipment
Gijong Lee | 2023-11-13 10:18
[Semiconductor]
TC bonder in high demand from HBM and 3D packaging
Noh Tae Min 기자 | 2023-09-07 10:07
[Semiconductor]
Earnings of Samsung’s fab equipment subsidiary show tech giant reducing China spending
Noh Tae Min 기자 | 2023-04-03 18:57
Kang sung tae | 2023-02-17 17:14
[Component]
BOE removed from Samsung’s 2022 supplier list
Gijong Lee | 2022-11-30 09:53
[Display Panel]
HB Solution signs QD inkjet supply deal with Samsung Display
Gijong Lee | 2022-11-03 16:10
Gijong Lee | 2022-07-06 09:50
[Semiconductor]
Samsung’s fab equipment subsidiary hits record revenue in 2021
Jang Keyoung Yoon | 2022-04-15 14:07
[Semiconductor]
LTC to acquire Mujin’s fab equipment business
Stan Lee | 2022-02-17 15:15
Gijong Lee | 2022-01-24 11:24
Jang Keyoung Yoon | 2021-12-09 08:16
[Semiconductor]
Semes CEO Kang in US visit to secure talents
Jang Keyoung Yoon | 2021-10-01 22:22
Nari Lee | 2021-08-24 21:11
[Semiconductor]
South Korean fab equipment makers post strong Q2 earnings
Gijong Lee | 2021-08-18 12:54
[Semiconductor]
Tesna to spend 81.9 billion won to expand CIS testing facility
Nari Lee | 2021-08-11 19:11
[Semiconductor]
Samsung cancels Mujin’s chip distribution rights
Jang Keyung Yun | 2021-08-05 13:53
[Semiconductor]
Raontec to win overseas customers for its robots, expand into pharmaceutical industry
Nari Lee | 2021-05-26 17:51
[Semiconductor]
Korean fab equipment firms post strong growth in Q1
Gijong Lee/Nari Lee | 2021-05-21 14:50
[Semiconductor]
SK Hynix forms new fab equipment development group
Nari Lee | 2021-04-14 18:35