기사 (63건)
[Semiconductor]
Samsung wins Nvidia’s 2.5D package order
Noh Tae Min 기자 | 2024-04-08 06:37
Noh Tae Min 기자 | 2024-04-04 14:17
[Semiconductor]
SK Hynix expects ‘customized’ HBM demand to become stronger
Noh Tae Min 기자 | 2024-03-28 05:12
[Semiconductor]
Micron says this year’s HMB capacity has been sold out
Roh Tae Min | 2024-03-21 19:42
[Semiconductor]
SK Hynix sees customer deposit surge from high demand for HBM
Roh Tae Min | 2024-03-13 09:09
Roh Tae Min | 2024-03-04 07:28
[Product]
LG adds 65-inch model to OLED Evo lineup
Lee Min-Jo | 2024-02-27 09:17
JY Han | 2023-12-04 09:54
[Semiconductor]
TC bonder in high demand from HBM and 3D packaging
Noh Tae Min 기자 | 2023-09-07 10:07
[Semiconductor]
SK Hynix gives HBM3E sample to customer
YUN SANG-HO | 2023-08-22 15:00
[Semiconductor]
ASICLAND developing new packaging tech that uses silicon bridge
Roh Tae Min | 2023-08-03 09:50
JY Han | 2023-07-19 17:31
[Semiconductor]
Rebellions aiming to launch alternative AI chip to Nvidia’s L40
Noh Tae Min 기자 | 2023-07-17 10:03
[Semiconductor]
FuriosaAI highlights importance of software for AI chips
Noh Tae Min 기자 | 2023-07-13 09:41
Noh Tae Min 기자 | 2023-06-22 15:40
Gijong Lee | 2023-06-05 17:49
JY Han | 2023-03-27 16:23
JY Han | 2023-03-16 07:58
[Semiconductor]
Korean OSAT companies suffers from low factory operation rates
Jang Keyoung Yoon | 2023-03-03 10:01
[Semiconductor]
FuriosaAI to start production of 5nm AI chip for ChatGPT
Jang Keyoung Yoon | 2023-02-15 15:22