US chip giant Micron said on Wednesday that its high bandwidth memory (HBM) production capacity this year has already been sold out.
Enough orders have also been placed for its capacity next year to be almost filled, the company said during its conference call for its December-February quarter, its fiscal second quarter for 2024.
Its latest HBM3E will be used in Nvidia H200 and the chip is also being qualified by other customers, Micron said.
The company claimed that customers said that its chips consumed 30% less power compared to its competitors __ meaning Samsung and SK Hynix.
According to analyst firm TrendForce, Micron is expected to secure a HBM capacity of 20,000 wafers per month by the end of the year. By comparison, Samsung is expected to secure 130,000 wafers per month, and SK Hynix between 120,000 to 125,000 wafers per month, the firm said.
Meanwhile, Micron returned to the black after six quarters of losses. The company said it recorded US$191 million in operating profit during its fiscal second quarter, a jump of 57.7% year-on-year.
